![]() This study shall benefit the newly designed BGA packages through rapid generation of reliability data and by providing insight into the reliability aspects of the BGA assembly with interface fracture issues. The solder/IMC failure prediction could not be inferred solely from inelastic strain in the bulk solder joint but should also consider the damage of the interface. Reflow Soldering Technology for BGA Basically, BGA package assembly is compatible with SMT assembly procedure. Catastrophic fracture of the BGA assembly was predicted during the first temperature cycle due to the relatively low input strength and toughness of the brittle-like solder/IMC interface properties. The solder/IMC interface crack initiated at the interface near the package side of the assembly. Results show that the most critically stressed solder joint was the one located underneath the edge of the silicon die. One of the most common reasons for BGA repair and rework is the fact that the balls of tin solder, the ball in ball grid array, become unreliable due to the continuous heating and shrinking of the board or its components as caused by the normal heating cycle of the board. A Ball Grid Array or BGA is a surface mount package (SMD component) without leads. The temperature ramp rate of 11 ☌/min was used. Reflow soldering might not form a BGA joint if there is insufficient solder paste or deformed/missing solder balls. This was followed by temperature cycling between 125 and -40 ☌ with 15 minutes dwell time at upper and lower peak temperature levels. Solder reflow cooling begins from the assumed stress-free reflow temperature of 220 ☌ to 25 ☌ at 1.3 ☌/s. The unified constitutive (Anand) model was used to describe the temperature- and strain rate-dependent response, and solder/IMC interface damage of the SAC405 solder interconnects. Finite element (FE) analysis was utilized to model the BGA assembly under the prescribed temperature loading profile. This could contribute to the solder/IMC interface damage and cracking. The ball grid array (BGA) test assembly was exposed to thermo-mechanical loading during solder reflow cooling and subsequent reliability temperature cycles. The lead-free Sn-0.4Ag-0.5Cu (SAC405) solder arrays provides an interconnection between the electronic package and printed circuit board (PCB) of the assembly. For Package-on-Package, or PoP devices, these guidelines include: developing the proper thermal reflow profile, the correct PCB pad site dress and. Intel has developed the processes to remove and replace high density electronic components packaged in a Ball Grid Array, or BGA format. *Phone: +60127781410 Fax: +6075566159īall grid array, Solder/IMC interface, SAC405 solders, Reflow cooling, Temperature cycle Abstract Intel® Package on Package (PoP) BGA Rework Video. School of Mechanical Engineering, Faculty of Engineering, Universiti Teknologi Malaysia, 81310 Johor Bahru, Malaysia.
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